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芯片与器件FAE经理

Qingdao, China; Fuzhou, China; Hangzhou, China; Chengdu, China; Wuhan, China; Beijing, China; Guangzhou, China; Shanghai, China; Hefei, China; Shenzhen, China💼 Full-time🗓 2026-08-16 → 2026-09-28

Core

Drive market expansion and manage Design-In (DI) projects for chip and device solutions, resolving technical issues to enhance product competitiveness.

Role type

Field Application Engineer (FAE) Manager

Builds

Chip and device product solutions for customers

Domain

Semiconductor / Electronics

Required skills

DI project management, technical problem solving, market opportunity development, cross-functional coordination, stakeholder relationship management

Preferred skills

Software engineering background, chip design experience, leadership in large-scale events, award-winning competition participation

Technologies

Semiconductor devices, chip design tools

Responsibilities

Conduct market presentations and product solution design; Lead and coordinate customer DI projects; Diagnose and resolve technical issues in customer projects

Seniority

Manager, hands-on IC

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