Senior Thermal/Hardware Engineer
Core
Lead system-level thermal design, simulation, and validation for high-density, high-power networking platforms from concept to mass production.
Role type
Senior IC thermal/hardware engineer (electronics packaging)
Builds
High-density networking platforms, line cards, and chassis
Domain
Data center and networking hardware
Required skills
Thermal design, electronics packaging, CFD simulation (FloTHERM), thermal test setup and instrumentation, manufacturing processes, Python scripting, system-level tradeoffs
Preferred skills
Fan selection and control methodologies, design for manufacturability, root-cause analysis, cross-functional collaboration
Technologies
FloTHERM, thermocouples, DAQs, environmental/thermal chambers, airflow/pressure benches
Responsibilities
Lead system-level thermal design, simulation, and validation; Own end-to-end thermal development lifecycle; Design and validate thermal solutions for enclosures and line cards; Define and execute thermal validation test plans; Drive system-level design tradeoffs; Engage manufacturing partners; Lead root-cause analysis; Provide technical mentorship
Seniority
Senior, hands-on IC with team leadership