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BBU智能化硬件开发工程师

Shanghai, China💼 Full-time🗓 2026-09-18 → 2026-09-28

Core

Lead hardware architecture design for 5G/5.5G/6G BBU systems, focusing on high-speed Serdes, DDR memory, power integrity, and thermal reliability to support next-generation base station platforms.

Role type

Senior IC hardware engineer (high-speed base station architecture)

Builds

High-bandwidth, high-reliability BBU hardware platforms for 5G-A/6G base stations

Domain

Telecommunications / High-speed digital hardware

Required skills

High-speed Serdes (112G/224G PAM4) design, DDR4/LPDDR5X hardware design, SI/PI simulation and debugging, Power integrity (PI) and noise analysis, Thermal design and power budgeting, EMC/EMI compliance, PCB layout and stack-up optimization, Oscilloscope and spectrum analyzer usage

Preferred skills

Experience with 5G-A/6G hardware evolution trends, OIF CEI protocol knowledge, Advanced thermal modeling and aging reliability design

Technologies

Serdes, DDR4/LPDDR4X/LPDDR5X, DC-DC/LDO, PCB, EMC, SI/PI simulation tools

Responsibilities

Define BBU hardware architecture and technical roadmaps; Simulate and debug high-speed differential links and memory interfaces; Design power distribution networks and thermal management systems; Resolve EMC/EMI issues and lead mass production validation; Build and maintain hardware design and simulation standards

Seniority

Senior, hands-on IC

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