板级先进工艺设计工程师
Core
Design end-to-end board-level assembly and reliability solutions for high-density computing products, focusing on large chip assembly, warpage control, and mixed-module integration.
Role type
Senior IC board-level advanced process design engineer
Builds
High-complexity PCBA assemblies, mixed integration modules, and reliable computing boards
Domain
Electronics manufacturing, PCB materials, and mechanical reliability engineering
Required skills
DFM/DFR/DFA design, mechanical reliability simulation (Hypermesh/Abaqus), PCB material selection, solder paste/adhesive engineering, mixed-module integration, failure analysis (micro-scale sampling/NDT), SMT/reflow/laser welding process knowledge
Preferred skills
Experience with large chip assembly, thermal-mechanical coupling simulation, high-frequency PCB materials, ProE/AutoCAD modeling
Responsibilities
Develop board-level assembly and reliability schemes for computing products; Perform root cause analysis and solve reliability issues; Lead process technology planning and platform capability building; Execute mechanical reliability design and simulation for large chips and modules
