模组工艺开发工程师
Core
Lead full-process packaging development for power modules, focusing on DA chip mounting, WB bonding, Reflow soldering, and Molding encapsulation to build a high-quality, stable packaging platform.
Role type
Senior IC power module packaging process engineer
Builds
Power module packaging processes and platforms
Domain
Power electronics / Semiconductor packaging
Required skills
Power module packaging process development, DA chip mounting, WB bonding, Reflow soldering, Molding encapsulation, FMEA, CP, DOE, SPC, MSA, root cause analysis, process parameter optimization, quality control standards
Preferred skills
Industry trend analysis, technology roadmap planning, next-generation packaging technology pre-research
Technologies
DA, WB, Reflow, Molding
Responsibilities
Lead full-process packaging development for power modules; End-to-end quality management for product lifecycle from R&D to mass production; Track industry trends and lead technology iteration planning
Seniority
Senior, hands-on IC
