Process Engineer
Core
Develop innovative module packaging solutions for new consumer sensing products, owning process development from concept to high-volume manufacturing with external partners.
Role type
Senior IC electronic packaging engineer (semiconductor/sensor)
Builds
Module packaging solutions for consumer sensing systems
Domain
Semiconductor manufacturing / Consumer electronics
Required skills
semiconductor packaging technology, assembly processes (wafer thinning, dicing, die attach, wirebond, encapsulation, SMT, molding), materials science, failure analysis (FA), DOE, simulation, OSAT management, cross-functional leadership
Preferred skills
capacitive sensing module packaging, customer-facing cosmetic packaging, AI for process efficiency, wafer bumping, RDL, TSV, root cause analysis tools
Technologies
DOE, FMEA, simulation tools, AI tools
Responsibilities
Define process equipment, materials, and flows for module packaging; develop new package concepts from PoC to production; collaborate with reliability and design teams using FMEA; integrate simulations to validate design impact; manage communication with integrators and suppliers; consolidate major issues lists; hand off projects to operations; present concepts and data at executive reviews.
Seniority
Senior, hands-on IC
