IC Package Integration Lead
Core
Lead package integration and architecture efforts to bring innovative packaging solutions from concept to mass production for advanced semiconductor products.
Role type
Senior IC Packaging Engineering Lead
Builds
Advanced package solutions, modules, and technology developments for high-volume manufacturing
Domain
Semiconductor industry, advanced packaging
Required skills
Package co-design, package technology development, NPI and qualification, design documentation and rules, technical risk assessment, cross-functional team leadership, assembly partner management, high-density interconnects, thermo-mechanical reliability, Si floor plan and package layout, signal/power integrity, design for manufacturing, cellular/connectivity/PMU packaging knowledge, physics fundamentals
Preferred skills
Managerial skills, problem solving, independent project leadership, team management
Technologies
Cadence APD, Allegro
Responsibilities
Lead package co-design with Silicon, Packaging, and Systems engineering teams; Drive package technology development with broad impact; Co-work with assembly partners on new packages from development to high volume production; Create package design documentation, design rules, technical risk assessment, and checklists
Seniority
Senior, hands-on IC with leadership responsibilities