IC Packaging Integration Engineer
Core
Lead SoC package integration and architecture for advanced semiconductor packaging solutions.
Role type
Senior IC Packaging Integration Engineer
Builds
High-density, high-performance interconnects and advanced packaging structures (FOWLP, 2.5D, 3D, coreless MCM)
Domain
Semiconductor manufacturing and advanced packaging
Deliverable
production ML models
Required skills
Advanced packaging technologies (FOWLP/2.5D/3D), DOE principles, statistical analysis, failure analysis, AI/ML for process optimization, thermal/mechanical reliability, signal/power integrity, schematic and layout review (Allegro)
Preferred skills
MS/PhD, system integration experience, multi-functional packaging knowledge
Technologies
Allegro, FOWLP, 2.5D, 3D, coreless MCM
Responsibilities
Lead SoC package integration and architecture efforts; define and execute test vehicles with foundries and OSATs; apply AI/ML to foundry and OSAT datasets for yield improvement; lead package failure analysis and root cause investigations; drive NPI build plans for OSATs
Seniority
Senior, hands-on IC
