Product Design Engineer - DFM SiP / PCBA NPI
Core
Develop next-generation System-in-Package (SiP) and Printed Circuit Board Assembly (PCBA) processes from concept to high-volume manufacturing, serving Apple's end products.
Role type
Senior IC packaging and NPI process engineer
Builds
Next-gen SiP architectures, robust process flows, and high-yield semiconductor packages
Domain
Semiconductor packaging and electronics manufacturing
Required skills
IC packaging, Surface Mount Technology (SMT), Printed Circuit Board Assembly (PCBA), mechanical design, GD&T, Tolerance Analysis, process risk assessment, equipment qualification, tooling design, material down-selection, yield improvement, cost reduction, failure analysis, design for experiments, mechanical simulation, data analysis (JMP), SPC, Cpk
Preferred skills
Transfer molding with fine pitch IC, sputter thin film processes for EMI shielding, leading assembly process development and qualification, material characterization, component failure analysis, statistical process control tools
Technologies
SMT, underfill, die attach, wire bond, molding, dicing saw, Laser, sputter thin film materials, JMP, SPC, Cpk
Responsibilities
Define next-gen SiP architecture based on functionality, form factor, and process capability; define general process flow and assess process risks; lead process development in POC and NPI builds; drive OSAT teams for material, equipment, and recipe optimization; troubleshoot process issues and drive corrective actions; collaborate with EE and REL teams for failure analysis; drive yield improvement and cost reduction initiatives
Seniority
Senior, hands-on IC
