IC Package Integration Lead
Core
Lead package integration and architecture efforts to bring advanced packaging solutions from concept to high-volume mass production for semiconductor products.
Role type
Senior IC Packaging Engineering Lead
Builds
Advanced semiconductor packages, modules, and technologies for Silicon TOs
Domain
Semiconductor industry, advanced packaging
Required skills
Package co-design, package technology development, NPI and qualification, design documentation and rules, technical risk assessment, cross-functional team leadership, advanced packaging technologies (high density interconnects), thermal/mechanical reliability, signal/power integrity, design for manufacturing, cost optimization
Preferred skills
Managerial skills, cellular/connectivity/PMU packaging background, physics fundamentals, independent project leadership
Technologies
Cadence APD, Allegro