IC Packaging Simulation Engineer
Core
Perform stress and deformation simulation of IC packages to ensure device yield and reliability, while developing automated model-generation tools using Gen-AI/ML.
Role type
Senior IC packaging simulation engineer (FEM/ML)
Builds
Automated simulation workflows and reliability models for IC packages
Domain
Semiconductor manufacturing / Electronic packaging
Deliverable
production ML models
Required skills
FEM simulation (ANSYS, ABAQUS), scripting CAD/FEM software, Generative-AI/Machine Learning, numerical tools, mechanics and mathematics, packaging materials knowledge
Preferred skills
MATLAB, Scientific Python, electronic packaging structures knowledge, independent R&D
Technologies
ANSYS, ABAQUS, Hypermesh, MATLAB, Scientific Python
Responsibilities
Numerical modeling of stress and deformation for chip-package and package-board interactions; Exploring feasibility and identifying reliability risks during product definition; Supporting new product introduction (NPI) and solving development/manufacturing problems; Programming/scripting CAD/FEM and Gen-AI/ML tools for automated model generation.
Seniority
Senior, hands-on IC
