Technical Program & Quality Manager (System-in-Package)
Core
Manage technical programs and quality systems for high-volume manufacturing of System-in-Package (SiP) designs, partnering with suppliers and internal teams to optimize design for manufacturability.
Role type
Senior Technical Program & Quality Manager (Semiconductor Packaging)
Builds
High-volume manufacturing solutions for Apple SiP products
Domain
Semiconductor manufacturing / Electronic assembly
Required skills
Semiconductor packaging process expertise, Factory Acceptance (FA) techniques, Root cause analysis, Cross-functional collaboration, Supplier management (OSATs/CMs), Data analysis (JMP/Tableau), Program management
Preferred skills
Reliability engineering knowledge, Problem-solving in complex technical environments, Asia-based supplier partnership experience, Technical documentation and presentation skills
Technologies
SMT, underfill/mold, laser, PVD/coating, bending, testing
Responsibilities
Develop and implement factory and quality control systems, Optimize product design and process for manufacturability, Serve as key point of contact during factory or quality excursions, Identify, address, and prevent critical issues, Drive continuous improvement in factory operations and product quality
Seniority
Senior, hands-on IC
