Technical Program Manager, System in Package
Core
Operation expert for manufacturing process, yields, and factory readiness for mass production of consumer electronics.
Role type
Senior Technical Program Manager (Manufacturing Operations)
Builds
High-volume consumer electronics products
Domain
Consumer electronics manufacturing / Semiconductor packaging
Required skills
SMT and packaging process knowledge, yield improvement, OEE optimization, SPC, MSA, GRR, FMEA, cross-functional team leadership, matrix organization experience
Preferred skills
PCBA, molding, laser processing, sputtering, assembly, test, and pack-out processes, Design of Experiments (DOE), failure analysis (FA), automation, DFM design, electrical engineering background
Technologies
SMT, SPC, MSA, GRR, FMEA, DOE, FA
Responsibilities
Own end-to-end factory output, yield, quality, and readiness for volume ramp; Integrate lessons learned into future designs and apply predictive methods; Maintain open issue lists and drive closure prior to mass production; Partner with manufacturing partners to advance yield and operational excellence; Track manufacturing-partner performance through audits and verification; Deliver executive-level status reports weekly; Escalate key concerns to senior management
Seniority
Senior, hands-on IC
