IC Package Design Engineer
Core
Lead advanced package architecture and physical design for semiconductor packages (SoC, memory, RF, cellular) across Apple products.
Role type
IC Package Design Engineer
Builds
Advanced electronic packaging solutions for iPhone, iPad, Mac, Apple Watch, and Apple TV
Domain
Semiconductor packaging and high-speed interface design
Required skills
IC package physical design, parasitic extraction (RLGC), S-parameter modeling, Signal/Power Integrity (SI/PI) analysis, cross-functional system co-optimization, CAD tool evaluation, automated design flows
Preferred skills
Cadence Allegro or Mentor Xpedition, SiP/PoP/wirebond verification (Calibre, CAM350), high-speed interface layout (DDR, PCIe), HFSS or PowerSI simulation, substrate manufacturing processes, DRC/DFM, Unix/Linux scripting (Python, Perl, TCL)
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