Mechanical Engineer || || Creo, UG NX || Electronics Packaging || Chassi Design || Enclosure Design || Exp : 8+ years
Core
Design complex electro-mechanical packaging, chassis, and enclosures for high-density rack-mount telecom and networking systems, ensuring thermal efficiency and manufacturability.
Role type
Senior IC mechanical engineer (electronics packaging/chassis design)
Builds
High-volume manufacturing-ready hardware for Cisco networking and telecom solutions
Domain
Telecommunications + Hardware Engineering
Deliverable
production ML models | product features
Required skills
CREO, thermal management, FEA/CFD simulation, DFM/DFA, FMEA, cost modeling, structural analysis
Preferred skills
mentoring junior engineers, supply chain optimization
Technologies
CREO, FEA, CFD
Responsibilities
Lead design feasibility and prototyping for electro-mechanical systems; perform thermal and structural simulations to ensure reliability; drive DFM/DFA standards and assist with fixture design; analyze BOMs and cost models to meet COGS targets; manage medium-scale mechanical projects from concept to production.
Seniority
Senior, hands-on IC
