Integration Engineer Development EoPM
Core
Drive continuous improvement on new processes, product architecture, yield, and performance for semiconductor manufacturing integration.
Role type
Senior IC integration engineer (semiconductor packaging)
Builds
Novel insulator integration into wafer packaging, chip-scale modules, power FET modules
Domain
Semiconductor manufacturing and advanced packaging
Required skills
semiconductor technology, device physics, yield improvement, manufacturing processes, pick-and-place, sintering, CSP, advanced packaging, RDL, polyimide, dicing, module assembly
Preferred skills
Chip Package Interaction (CPI), copper plating, wafer thinning
Technologies
Shiny, Excensio, JMP, Minitab, SiView, MS Excel, MS Project
Responsibilities
Support product development from initial design through full-scale manufacturing, collaborate with Manufacturing Engineering to implement manufacturable process recipes, translate high-level objectives into detailed execution plans
Seniority
Senior, hands-on IC