Principal Engineer – Process Development, Dry Etch, NAND
Core
Provide technical leadership for dry etch process development across critical NAND modules, shaping process roadmaps and solving high-impact structural and device challenges.
Role type
Principal Engineer, Process Development (Dry Etch)
Builds
Advanced NAND memory structures and devices
Domain
Semiconductor manufacturing, NAND flash memory
Required skills
dry etch technology fundamentals, plasma physics/chemistry, reactor types/chemistries, SPC/DOE/statistical analysis, structured root cause analysis, technical leadership through influence, cross-functional alignment
Preferred skills
data science basics, Python, AI-enabled analysis
Technologies
plasma etch reactors, AI-assisted tools
Responsibilities
Lead dry etch unit process and critical module development; Lead cross-functional teams to solve complex structural problems; Present and drive dry etch process and technology roadmaps; Drive advanced scalability solutions for high aspect ratio etches; Lead supplier head-to-heads and vendor engagements; Provide technical mentorship and act as a resource for peers
Seniority
Principal, hands-on IC with strategic roadmap ownership