Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND
Core
Distinguished Member of Technical Staff leading Cell Film Process Development, specifically Chemical Mechanical Polishing (CMP) for NAND technology, defining long-term strategies and driving breakthrough innovations.
Role type
Distinguished Member of Technical Staff (DMTS), strategy-level IC
Builds
Next-generation CMP process innovations, hardware roadmaps, and technology roadmaps for NAND memory
Domain
Semiconductor manufacturing, Memory (NAND), Chemical Mechanical Polishing (CMP)
Required skills
CMP process development, pad–slurry–wafer interactions, mechanistic slurry chemistry, pattern density/layout effects, statistical process control (SPC), data analysis, process qualification methodologies, supplier technical reviews, hardware roadmap decisions
Preferred skills
AI tool integration, cross-functional leadership, executive-level communication
Technologies
300 mm CMP OEM platforms, FOAK developments, recipe architecture
Responsibilities
Define long-term technology and equipment strategies for CMP; Architect and drive next-generation CMP process innovation; Lead resolution of complex yield, defectivity, and integration challenges; Define and execute CMP hardware and supplier roadmaps; Provide forward-looking technical leadership on scaling risks; Mentor senior engineers; Represent CMP technology in external forums
Seniority
Distinguished Member of Technical Staff (DMTS), strategy & mentorship
