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SR ENGINEER, APTD PHOTO Process

Taichung City, Taichung City, Taiwan💼 Full-time🗓 2026-06-17 → 2026-09-29

Core

Drive HBM process development and yield improvement in PHOTO process, supporting advanced package technology research and development.

Role type

Senior Process Engineer (Photolithography)

Builds

HBM memory chips and advanced packaging solutions

Domain

Semiconductor manufacturing / Photolithography / Advanced Packaging

Required skills

photolithography fundamentals, materials characterization, root cause analysis, test structure design, cross-team coordination, technical documentation

Preferred skills

independent thinking, innovation

Technologies

PR coating, exposure, develop flow, Reticle Tapeout, CD control, overlay metrology

Responsibilities

Drive HBM process development and yield improvement; Assist advanced package technology research; Troubleshoot complex process engineering issues; Coordinate mechanical characterization and testing globally; Review and present data with recommendations to suppliers

Seniority

Mid-Senior, hands-on IC

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