Staff/Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
Core
Lead Media Health Manufacturing and test flow development for Micron's next-generation High Bandwidth Memory (HBM) products, focusing on DRAM, Interface, and Stacked Die architectures.
Role type
Staff/Principal Engineer, HBM Product System Engineering
Builds
Next-generation HBM products (DRAM, Interface, Stacked Die) for data center and AI applications
Domain
Semiconductor manufacturing (HBM/DRAM)
Required skills
Semiconductor product engineering, circuit analysis, root cause analysis, statistics and data analysis, scripting, project management, team leadership, cross-functional collaboration
Preferred skills
HBM product engineering experience, AI tool usage for productivity
Technologies
CAD tools, Verilog simulations
Responsibilities
Develop and validate manufacturing test flows for HBM designs; Improve device and stacked die yield through circuit debug and test coverage optimization; Support new product design verification using simulation tools; Resolve manufacturing test flow and RMA device issues; Mentor team members and drive technical innovation; Collaborate with Fab, Design, and Technology teams; Make technical decisions on risk analysis and project prioritization.
Seniority
Staff/Principal, hands-on IC with leadership