Senior Staff Burn-In System Product Developer
Core
Lead architecture, development, and deployment of next-generation burn-in solutions for advanced semiconductor products (CPUs, GPUs, AI accelerators, chiplets) to ensure product quality and reliability.
Role type
Senior Staff IC Product Developer (Burn-In Systems)
Builds
Scalable burn-in infrastructure, intelligent manufacturing solutions, and AI-driven analytics platforms for semiconductor manufacturing.
Domain
Semiconductor manufacturing, High-Performance Computing (HPC), Artificial Intelligence (AI)
Deliverable
production ML models | product features
Required skills
Semiconductor burn-in engineering, Reliability engineering, System architecture, Vendor management, Stakeholder leadership, Predictive analytics, Machine learning, Generative AI, Root cause analysis, NPI support
Preferred skills
Chiplet-based architecture expertise, 2.5D/3D integration knowledge, HBM device experience, Smart manufacturing implementation
Technologies
Burn-in boards and sockets, Control and monitoring systems, Automation frameworks, Data pipelines, Dashboards
Responsibilities
Define and drive burn-in system architecture for packaged semiconductor products; Develop scalable solutions for advanced package technologies; Lead development of system-level infrastructure including power delivery and thermal management; Drive vendor management and supplier effectiveness; Collaborate on burn-in strategies for product qualification and production; Utilize predictive analytics and ML for anomaly detection, failure prediction, and yield improvement; Build automated data pipelines for monitoring burn-in performance.
Seniority
Senior Staff, hands-on IC with strategic influence
