Senior Director, Package Design Engineering
Core
Lead global Technical Program Management (TPM) for AI/Datacenter Infrastructure Power NPI and package engineering programs, ensuring execution, quality, and production readiness.
Role type
Senior Director, Technical Program Management (IC)
Builds
AI/Datacenter Power packages (SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management systems, PMICs) and their manufacturing ramp.
Domain
Semiconductor industry, Power Management, Package Engineering, NPI, OSAT/CM management
Required skills
Global program governance, NPI execution, cross-functional task force leadership, risk management, root-cause analysis, executive communication, OSAT/CM partner management, team development, strategic roadmap translation, data-driven problem solving.
Preferred skills
Smart Power Stage/Vertical Power Stage experience, SiC/GaN technologies, DBC/AMB, wafer-level/flip-chip technologies, formal TPM methodologies.
Technologies
OSAT/CM processes, DOE, SPC/statistical methods, process optimization, qualification protocols.
Responsibilities
Lead global TPM organization for AI/Datacenter Power NPI; Establish end-to-end NPI program plans and governance; Identify and mitigate technical/schedule risks; Lead cross-functional task forces for quality/yield issues; Coordinate with OSATs for EBR execution and production ramp; Develop TPM teams at strategic OSAT locations; Drive transition from qualification to volume manufacturing; Provide executive reporting on program health.
Seniority
Senior Director, global leadership & strategy
