CVG200 Conversions Rework Operator II - 404
Core
Repair electronic assemblies by removing and replacing ball-grid array (BGA) components and analyzing x-rays for defects.
Role type
Manufacturing repair operator
Builds
Repaired electronic assemblies
Domain
Electronics manufacturing
Deliverable
physical/clinical work
Required skills
BGA component handling, x-ray visual analysis, basic arithmetic, reading technical instructions, safety compliance
Responsibilities
Remove and replace or reflow BGA components, visually analyze x-rays for circuit shorts or insufficient solder, ensure assemblies are properly handled and marked, maintain clean and organized work area, adhere to safety and health rules
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