Advanced Packaging Technology Development Process Integration Engineer
Core
Develop and qualify upcoming technology nodes for Intel's advanced packaging manufacturing roadmap, ensuring processes are robust for high-volume manufacturing.
Role type
Process Integration Engineer (Advanced Packaging)
Builds
Advanced packaging solutions (2.5D, 3D IC, fan-out, flip chip) for next-generation semiconductor devices
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Process integration, yield analysis, quality management, defect reduction, process development, semiconductor advanced packaging flows
Preferred skills
Cross-functional problem-solving, leading technology transfer to high-volume manufacturing, value engineering
Technologies
2.5D, 3D IC, fan-out, flip chip
Responsibilities
Enable advanced packaging manufacturing roadmap by developing and qualifying upcoming technology nodes; Own and drive closure of defect, yield, reliability, and device entitlement gaps; Collaborate with module teams to support process readiness reviews and transfer milestones; Partner with device, yield, reliability, and packaging teams to develop robust base die solutions; Contribute to value engineering initiatives; Support cross-functional problem-solving efforts
Seniority
Mid-Senior level (3+ years experience with Bachelor's, 2+ with Master's, or 0 with PhD)