Process Integration Development Engineer
Core
Engineer performing FIB lamella preparation and TEM characterization on semiconductor nanostructures to support fabrication, failure analysis, and process integration.
Role type
hands-on IC process integration development engineer (TEM/FIB)
Builds
semiconductor process nodes and metrology strategies
Domain
semiconductor manufacturing / materials science
Deliverable
physical/clinical work
Required skills
FIB sample preparation, TEM operation, electron diffraction, strain analysis, EDS, EELS, semiconductor process integration, troubleshooting process flow issues
Preferred skills
semiconductor process integration knowledge, independent and team collaboration
Technologies
Focused Ion Beam (FIB), Transmission Electron Microscope (TEM)
Responsibilities
Prepare FIB lamellae and conduct TEM imaging/diffraction/analysis on semiconductor nanostructures; optimize metrology strategies and troubleshoot process flow issues; contribute to continuous improvement in high-volume manufacturing environments
Seniority
Experienced Hire, hands-on IC