Packaging Module Development Engineer
Core
Design and optimize assembly processes and equipment for semiconductor packaging to enhance manufacturing efficiency, product reliability, and quality.
Role type
Senior IC packaging process engineer
Builds
Next-generation semiconductor packaging solutions and manufacturing workflows
Domain
Semiconductor manufacturing / Electronics assembly
Required skills
DOE principles, statistical methodologies, equipment design, material specification definition, failure mechanism analysis, process optimization, manufacturability analysis, quality system standardization
Preferred skills
Statistical Process Control (SPC), hands-on semiconductor packaging experience, cross-functional collaboration
Technologies
DOE, SPC, thermal/humidity testing equipment, dynamic force testing equipment
Responsibilities
Develop and optimize assembly processes and equipment; Apply DOE and statistical methods to refine processes; Design equipment for evaluating silicon and packaging technologies under simulated field conditions; Define material specifications and collaborate with supply chain teams; Lead initiatives to solve technical packaging reliability problems; Standardize equipment qualification practices and manufacturing quality systems
Seniority
Senior, hands-on IC
