Principal Product Yield Analysis Engineer
Core
Resolve complex test yield and reliability issues for next-generation memory devices (HBM) from design to mass production ramp-up.
Role type
Principal Product Yield Analysis Engineer (IC)
Builds
Next-generation memory and storage solutions (HBM) for the semiconductor industry
Domain
Semiconductor manufacturing, memory technology, failure analysis
Required skills
electrical failure analysis, physical failure analysis, optical fault isolation, EDA tools, fab data analysis, root cause analysis, cross-functional coordination, technical presentation, mentoring
Preferred skills
DRAM/HBM product experience, 3D-integration/packaging root cause analysis, sub-10nm process nodes, optical engineering, ML/AI applied to failure analysis, advanced programming (Java, C++, Python, R)
Technologies
ESDA, layout/net tracing, advanced image analyzers, photon emission, optical probing, microprobing, hybrid/2.5D/3D EDA tools
Responsibilities
Perform electrical and physical failure analysis and optical fault isolation to replicate probe failures and determine root cause; Leverage EDA tools for circuit understanding, timing characterization, and failure signature analysis; Dissect fab and probe data using ESDA, layout/net tracing, and image analyzers to monitor yields and correlate data; Lead weekly teleconferences to present findings and recommend corrective actions; Mentor remote FA teams on advanced methods and provide 1st silicon support for new products
Seniority
Principal, hands-on IC with mentorship