Staff Memory Design Engineer, HBM
Core
Designing and optimizing digital, analog, and memory core circuits for advanced DRAM products from concept to silicon.
Role type
Staff IC memory design engineer (DRAM)
Builds
High-performance memory chips (DRAM) for global markets
Domain
Semiconductor / Memory / Analog & Digital IC Design
Required skills
CMOS circuit design, VLSI, Analog circuit design, DRAM subsystem architecture, Circuit floor planning, Device reliability analysis
Preferred skills
Cross-functional technical leadership, Industry trend analysis, Innovation in memory generations
Technologies
Cadence Virtuoso, FINESIM, HSPICE, VERILOG
Responsibilities
Design digital, analog, and memory core circuits; Create optimized floorplans for circuit placement and routing; Conduct circuit simulations and analyze power/performance/reliability; Validate builds through reticle experiments and tape-out revisions; Manage layout resources and track project tasks; Lead design reviews and prepare project status reports
Seniority
Staff, hands-on IC with cross-functional leadership