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RAM Applications Lead Engineer

Taichung - Fab 16, Taiwan🌐 Remote💼 Full-time🗓 2026-06-26 → 2026-09-29

Core

Lead measurement and inspection strategy for high-volume semiconductor manufacturing, focusing on metrology and inline optical inspection (RDA) to ensure data quality and process control.

Role type

Lead Metrology & RDA Applications Engineer

Builds

Production-ready metrology recipes, RDA inspection applications, and statistical process control (SPC) methods for wafer fabrication.

Domain

Semiconductor manufacturing (memory and storage solutions)

Required skills

Semiconductor metrology and inspection (RDA), recipe development and validation, statistical process control (SPC), data analysis and visualization, cross-functional technical leadership, process anomaly detection and containment, tool matching and reference validation

Preferred skills

MS or PhD in relevant technical discipline, experience with e-beam, optical, and x-ray metrology systems, experience with eScan, Brightfield, Darkfield, Macro, and SP inspection platforms, driving standardization across global sites, partnering with equipment vendors

Technologies

JMP, Spotfire, Tableau, e-beam systems, optical metrology, x-ray methods, eScan, Brightfield, Darkfield, Macro, SP platforms

Responsibilities

Provide technical leadership for metrology and RDA strategy and readiness; develop and sustain metrology and RDA recipes; establish and improve SPC methods and monitor plans; lead cross-functional execution for production support and ramp activities; mentor engineers and technicians; drive continuous improvement to reduce defectivity and improve yield.

Seniority

Senior, hands-on IC with leadership responsibilities

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