Engineer, HIG HBM LAYOUT
Core
Design and development of critical analog, mixed-signal, custom digital blocks, and full chip level integration for High Bandwidth Memory (HBM) solutions.
Role type
Senior IC layout engineer (analog/mixed-signal)
Builds
Custom analog and mixed-signal blocks (Temperature sensor, PLL, ADC, DAC, LDO, Bandgap, Ref Generators, Charge Pump, Current Mirrors, Comparator, Differential Amplifier) for HBM chips
Domain
Semiconductor manufacturing, VLSI, High Bandwidth Memory (HBM)
Required skills
Analog layout design, Mixed-signal layout, Custom digital block layout, LVS/DRC/Antenna verification, Area/time estimation, Scheduling, Team leadership, Physical verification, Tape-out support
Preferred skills
Test Vehicle build experience, Multiple tape-out support experience
Technologies
Cadence VLE/VXL, Mentor Graphic Calibre
Responsibilities
Design and develop critical analog, mixed-signal, custom digital block, and full chip level integration; Perform layout verification like LVS/DRC/Antenna, quality check and support documentation; Guide peer team-members in execution of Sub block-level layouts & review critical items; Coordinate with peer groups across worldwide locations on multiple projects
Seniority
Mid-level, hands-on IC