Design Lead (HBM/Advanced Memory Design)
Core
Lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products, driving multi-functional collaboration to deliver high-quality silicon.
Role type
Senior IC Design Lead (HBM/Advanced Memory)
Builds
Next-generation HBM and advanced memory silicon products
Domain
Semiconductor / Memory / Advanced Packaging
Required skills
Memory array design, address decoders, datapath architecture, power delivery, verification flows, DFT, silicon validation, PPA optimization, technical leadership, risk assessment
Preferred skills
DRAM/DDR/HBM/LPDDR experience, global team leadership, advanced process nodes, DFM concepts, Synopsys/Cadence flows, 2.5D/3D stacking, TSV, successful tape-out track record
Technologies
Synopsys, Cadence, 2.5D/3D stacking, TSV
Responsibilities
Lead design and execution of memory subsystems and top-level integration; Own design planning, technical decision-making, and schedule execution; Coordinate with architecture, verification, layout, and product engineering teams; Review design specifications and implementation plans; Drive memory array design including address decoders and data path; Lead design reviews and issue resolution; Mentor engineers and guide skill development; Define and improve building methodologies using AI-enabled tools; Support silicon bring-up, debug, and yield improvement.
Seniority
Senior, hands-on IC with technical ownership and mentorship