Sr. Engineer, CMP/Bond Equipment Development
Core
Develop and optimize semiconductor processing equipment (CMP/Bond) to improve fab performance, yield, and throughput.
Role type
Senior IC equipment development engineer
Builds
Next-gen memory processing modules and equipment systems
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing (CMP)
Required skills
CMP/Bond equipment development, DOE, defect analysis, JMP Pro, statistical methods (SPACE, E3), problem-solving
Preferred skills
Mentorship, project management, cross-functional collaboration
Technologies
JMP Pro 18, SPACE, E3 software
Responsibilities
Install and start-up cutting-edge semiconductor equipment, drive module-level development, standardize methods across fabs, analyze equipment/process data to resolve integration issues, mentor new engineers, recommend process/equipment changes to improve metrics.
Seniority
Senior, hands-on IC
