Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory
Core
Developing, validating, and qualifying next-generation High Bandwidth Memory (HBM) products to ensure reliability, optimize manufacturing test flows, and improve yield for DRAM, interface, and stacked die architectures.
Role type
Senior IC Product & System Engineering (HBM Manufacturing)
Builds
Next-generation HBM products (DRAM, Interface, Stacked) for data center and AI applications
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), DRAM architecture
Required skills
CMOS technology, DRAM architecture, device physics, circuit debug, test coverage optimization, DFT strategy, root cause analysis, project management, cross-functional collaboration
Preferred skills
Semiconductor device coursework, Python scripting, JMP, statistics, data analysis
Technologies
Verilog, CAD tools, Python, JMP
Responsibilities
Optimizing test coverage for current and future HBM design architectures; developing and validating next-generation HBM products; supporting new product design verification using CAD tools and Verilog simulations; improving manufacturing test yields and reducing test time; resolving root causes of manufacturing test flow, qualification, and RMA device issues; promoting innovation to drive technical advantage; making technical decisions on risk analysis and project prioritization; collaborating with cross-functional teams (Fab, Design, Test, Quality).
Seniority
Senior, hands-on IC