ENGINEER, PRODUCT QE_PQA2 PARAM/WLR
Core
Lead Product Quality Engineering (PQE) and Wafer Level Reliability (WLR) programs to ensure DRAM/NAND memory reliability, manage MRB cases, and drive process improvements from NPI through HVM phases.
Role type
Senior IC Product Quality Engineer (Memory/Storage)
Builds
High-performance DRAM, NAND, and NOR memory products for data centers, AI, 5G, and mobile applications.
Domain
Semiconductor manufacturing and memory storage
Required skills
Semiconductor device physics, DRAM product specification, statistical data analysis, root cause analysis (8D/FMEA), failure analysis, CMOS/silicon memory device knowledge, reliability mechanisms, process flow understanding, quality metrics monitoring
Preferred skills
Wafer level burn-in monitoring, RMA management, ASSM event management, NPI/HVM program development, global quality dashboard analysis, team leadership, performance management
Technologies
DRAM, NAND, NOR memory, CMOS, silicon-based memory devices, MRB systems, RMA systems, OQRM, FMEA, 8D processes
Responsibilities
Manage MRB cases and postmortems for CAPA enhancement; monitor wafer level burn-in and shift left to probe; manage RMA analysis for process improvement; develop WLR and PARAM programs for fab process reliability; oversee outgoing quality control for wafer surface and pad defects; lead new product management and customer sample delivery; drive quality metrics improvements including OQRM and RMAs; monitor global quality dashboards and report reliability metrics; lead team performance objectives, training plans, and quality culture advocacy.
Seniority
Senior, hands-on IC with team leadership
