Staff/Senior Engineer -Package Health System and Analytics
Core
Develop and execute package health monitoring, simulation, and characterization activities to ensure robust semiconductor packaging solutions.
Role type
Staff/Senior Engineer (Semiconductor Packaging & Reliability)
Builds
Quantitative package health metrics, detection mechanisms, monitoring dashboards, and predictive models for inline defect characterization.
Domain
Semiconductor manufacturing, specifically packaging, test, and reliability engineering.
Required skills
Semiconductor packaging process knowledge, electrical and mechanical characterization, data analytics, statistical modeling, Python/R proficiency, cross-functional collaboration.
Preferred skills
AI/ML tools experience, defect inspection systems knowledge, advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
Technologies
Python, R, defect inspection systems, inline metrology tools.
Responsibilities
Define quantitative package health metrics; develop detection mechanisms and monitoring dashboards; perform electrical and mechanical characterization of packages; implement real-time defect detection and classification; conduct correlation and causation studies between process variables and reliability outcomes; develop data pipelines for end-to-end traceability across wafer, assembly, and test stages.
Seniority
Senior, hands-on IC
