ENGINEER, PEE DRY ETCH
Core
Establish and improve semiconductor process conditions, set up equipment parameters, and troubleshoot wafer fabrication issues to maximize yield and reduce costs.
Role type
Senior IC Fab Process & Equipment Engineer
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Wafer fabrication
Required skills
root cause analysis, Statistical Process Control (SPC), Design of Experiment, engineering statistical data analysis, process optimization, failure analysis, FMEA, 8D methodology, equipment parameter setup, yield improvement, cost reduction
Preferred skills
AI tool integration, continuous improvement methodologies, shift engineering collaboration, new process qualification, material evaluation
Technologies
Semiconductor equipment, wafer fabrication tools, AI-assisted tools
Responsibilities
Establish and modify process management projects; Analyze data to identify and resolve process issues; Evaluate products to ensure design and performance specifications; Conduct research to assess process adjustment requirements; Coordinate process/equipment/material evaluations; Liaise with material suppliers to achieve yield and quality objectives
Seniority
Mid-Senior, hands-on IC
