Senior substrate layout engineer
Core
Designing advanced package BGA substrates and 2.5D IC routing (RDL & Substrate) for CoWoS and EMIB technologies.
Role type
Senior substrate layout engineer
Builds
Advanced packaging substrates and 2.5D IC interconnects
Domain
Semiconductor packaging and advanced packaging
Required skills
BGA substrate layout, 2.5D IC routing, DRC/LVL/LVS verification, EDA tool evaluation, package design methodology development
Technologies
CoWoS_S, CoWoS_L, CoWoS_R, EMIB, EDA tools
Responsibilities
Perform DRC, LVL, and LVS checks on BGA substrate layouts; Route RDL and substrate for 2.5D IC structures; Collaborate with package design engineers to meet design requirements; Develop new layout methodologies; Evaluate new layout and PV EDA tools
Seniority
Senior, hands-on IC
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