Assembly Die Bond Process Engineer
Core
Develop, optimize, and sustain die bonding processes for semiconductor packages to ensure high quality, yield, and stability.
Role type
Process Engineer (Semiconductor Assembly)
Builds
Semiconductor packages
Domain
Semiconductor manufacturing
Required skills
Die bonding process development, process characterization, root cause analysis (8D, Fishbone, 5 Why, FMEA), Lean Manufacturing, Six Sigma, process documentation, yield analysis, NPI support
Preferred skills
None stated
Technologies
None stated
Responsibilities
Develop and qualify die bonding processes, troubleshoot process issues, monitor process capability and yields, drive continuous improvement projects, create process documentation
Seniority
Mid-level IC
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