Principal Tape Out Engineer
Core
Final checkpoint role ensuring semiconductor design data meets manufacturing requirements and quality standards before fabrication.
Role type
Principal Tape Out Engineer
Builds
Integrated circuit designs ready for fabrication
Domain
Semiconductor / Physical Design
Required skills
Physical design tools (Cadence, Synopsys), semiconductor manufacturing workflows, database verification, cross-functional collaboration, process improvement
Preferred skills
Master's degree in Electrical/Computer Engineering
Technologies
Cadence, Synopsys
Responsibilities
Coordinate and execute tape out process, verify design integrity by reviewing database and documentation, resolve technical issues with cross-functional teams, ensure deliverables conform to foundry requirements, maintain detailed records of tape out procedures
Seniority
Senior, hands-on IC
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