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Senior Packaging Development Engineer

Penang - Malaysia💼 Full-time🗓 2026-07-08 → 2026-09-29

Core

Design, develop, and scale to volume production of new packages and modules for industrial, automotive, renewable, and telecom markets.

Role type

Senior Packaging Development Engineer

Builds

New packages and modules for power delivery systems

Domain

Semiconductor industry, power electronics

Required skills

Package and module design, CAD software proficiency, thermal/electrical/mechanical simulation, assembly process optimization, manufacturing yield improvement, competitive benchmarking

Preferred skills

ANSYS Icepak/Q3D/Mechanical, system level simulation

Technologies

Auto CAD, SolidWorks, ANSYS Icepak, ANSYS Q3D, ANSYS Mechanical

Responsibilities

Design and develop new packages and modules, build system requirements into package definitions, use simulation software independently, interact with cross-functional teams and suppliers, optimize assembly materials and processes, benchmark competition and create new methodologies

Seniority

Senior, hands-on IC

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