Package Design Engineer
Core
Designing complex flip-chip-BGA packages for high-performance ASICs serving AI, networking, HPC, and 5G base stations, focusing on high-speed SerDes and very-high-power delivery.
Role type
Senior IC package-design engineer
Builds
High-performance package structures for ASICs
Domain
Semiconductor manufacturing / High-speed electronics
Required skills
flip-chip-BGA package design, signal integrity, power integrity, manufacturability, reliability, thermal management, project management, physical design (layout)
Preferred skills
Cadence APD (Allegro), Cadence SKILL, design automation coding
Technologies
Cadence APD, Cadence SKILL, Allegro
Responsibilities
Overall design responsibility for ASIC package designs including signal, power, manufacturability, reliability, and thermal aspects; Package Design of critical structures for SerDes, ADC/DAC, DDR; Schedule, prioritize, & track work across 2+ projects simultaneously; General flip-chip BGA package design & engineering; Project management and customer interface for design projects; Contribute to efficiency improvements through process development, automation, and documentation; Physical design (layout)
Seniority
Senior, hands-on IC
