Wafer Fab Process Engineer
Core
Lead process development, optimization, and transfer to manufacturing for thin film deposition, wafer thinning, thermal oxidation, diffusion, and implantation to achieve yield, quality, cost, and reliability targets.
Role type
Senior IC wafer fab process engineer
Builds
Semiconductor manufacturing processes and integrated circuits
Domain
Semiconductor manufacturing / Wafer fabrication
Required skills
Thin film deposition, wafer thinning, thermal oxidation, diffusion, implantation, SPC, DOE, FMEA, statistical data analysis, root cause analysis, process control planning, cross-functional collaboration, mentoring
Preferred skills
PhD in Engineering, Six Sigma certification (Green/Black Belt), 4" to 6" wafer scaling experience
Technologies
None explicitly listed (tools like SPC/DOE are skills)
Responsibilities
Lead process development, optimization, and transfer to manufacturing; Own and drive advanced process modules (thin film deposition, wafer thinning, thermal processes); Lead yield improvement and defect reduction initiatives; Drive new process integration (NPI) and process transfer; Perform root cause analysis and implement corrective/preventive actions; Define process control plans, SPC strategies, and OCAP execution; Mentor junior engineers and technicians
Seniority
Senior, hands-on IC
