CMP/Plating/Wafer Bond Equipment Maintenance Technician (Night Shift)

USA-Colorado-Fort Collins-4380 Ziegler Road💼 Full-time💰 $58,240–$58,240🗓 2026-09-29

Core

Maintain and improve wafer fabrication equipment (CMP/Plating/Wafer Bond) to support semiconductor production processes.

Role type

Senior IC equipment maintenance technician

Builds

Wafer fabrication equipment reliability and uptime for Broadcom's Wireless Semiconductor Division

Domain

Semiconductor manufacturing / Wafer fab

Deliverable

physical/clinical work

Required skills

Troubleshooting, data analysis (SPC, CMMS), electrical/mechanical/hydraulic/vacuum technologies, process documentation, mentorship

Preferred skills

Electronics/physics/mechanical engineering coursework, cross-functional collaboration

Technologies

SPC, CMMS, data mining tools

Responsibilities

Resolve complex equipment issues with minimal supervision, execute precise maintenance procedures, analyze performance metrics to drive improvements, train less experienced technicians, ensure timely completion of planned maintenance tasks

Seniority

Mid-level, hands-on IC

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About Broadcom

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.