Packaging Substrate Engineer
Core
Lead SoC package substrate technology development, pathfinding, and roadmap definition for Apple's consumer electronic products.
Role type
Senior IC packaging substrate engineer
Builds
New-generation package substrate solutions for iPhone, iPad, Mac, Apple Watch, Apple TV
Domain
Consumer electronics hardware packaging
Required skills
substrate technology development, manufacturing process knowledge, material/chemistry/mechanical engineering fundamentals, DFM, project management, cross-functional collaboration
Preferred skills
MS or Ph.D., hands-on substrate manufacturing experience (Cu plating, lithography, dielectric materials, via formation, solder resist, surface finish), package assembly and integration process knowledge, Cadence Allegro platform tools proficiency
Technologies
Cadence Allegro
Responsibilities
Lead SoC package substrate technology development, pathfinding, and roadmap definition; Work with industry partners to develop new substrate technologies from concept to HVM; Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability; Problem solving of technical issues during the full product development cycle.
Seniority
Senior, hands-on IC
