IC Packaging Integration Engineer
Core
Lead package integration and architecture efforts to bring innovative packaging solutions from concept to mass production for advanced semiconductor products.
Role type
IC Packaging Integration Engineer (Lead)
Builds
Advanced package solutions, modules, and technology developments for high-volume manufacturing
Domain
Semiconductor industry, advanced packaging
Required skills
Semiconductor packaging design, process & technology development, Si floor plan, package layout and architecture, enabling process technologies, thermal management, mechanical design, signal integrity (SI), power integrity (PI), material selection, component & system level reliability, testing, failure analysis (FA), high density interconnects, SiP packaging, physics fundamentals, design for manufacturing, BOM management, cost optimization
Preferred skills
MS/PhD in relevant field, experience with Cadence APD/Allegro tools, background in advanced SiP packaging
Technologies
Cadence APD, Allegro
Responsibilities
Lead package co-design with Silicon, Packaging, and Systems teams; drive package technology development; co-work with assembly partners on NPI and qualification; create package design documentation and technical risk assessments
Seniority
Senior, hands-on IC
