Component Engineering Technical Leader
Core
Lead system thermal technology roadmap and develop quality strategies for liquid cooling manufacturing processes for Cisco's electronic products.
Role type
Senior IC thermal engineering leader (liquid cooling & system thermal solutions)
Builds
End-to-end thermal solutions, liquid cooling systems, and advanced cooling packages for Cisco hardware
Domain
Semiconductor packaging, thermal management, liquid cooling, and electronic systems
Required skills
thermal solution design, liquid cooling technology, computational fluid dynamics (CFD), thermal validation, supplier ecosystem management, mechanical design validation, circuit packaging coordination, reliability analysis, trade-off analysis, test plan development
Preferred skills
microelectronics thermal cooling expertise, JEDEC JESD 51 standards, thermal interface material testing, immersion cooling experience, advanced air-cooling technologies
Technologies
Computational Fluid Dynamics (CFD) tools, data acquisition systems, environmental chambers, pumps, heat pipes, vapor chambers, heat sinks
Responsibilities
Develop thermal technology roadmap with suppliers; derive tradeoffs in thermal performance from experimental data; establish parameters for thermal design/testing; integrate circuit thermal simulation with system-level cooling; coordinate circuit packaging technologies; drive supplier ecosystem development and industry collaboration
Seniority
Senior, hands-on IC with strategic influence