Staff Packaging Engineer
Core
Design and develop advanced semiconductor packaging methods for high-density, high-reliability applications in AI, HPC, and power delivery markets.
Role type
Staff Packaging Engineer (Semiconductor)
Builds
Power SiP/modules, flip-chip LGA, multi-chip module, and power device packages for AI/HPC and server markets.
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Semiconductor package assembly processes, leadframe design, laminate technology, power QFN/SiP/module development, flip-chip packaging, wafer metallization (FSM/BM), wire-bonding, multi-chip module integration, Statistical Process Control (SPC), statistical analysis, AutoCAD, process optimization via DOE.
Preferred skills
Experience with OSAT/CM collaboration, qualification of new packages/processes, resolving process integration issues, customer complaint resolution.
Technologies
PowerQFN, Flip-Chip, SiP, LGA, FSM, BM, Wire-bonding, SPC, AutoCAD, Excel, PowerPoint, Word.
Responsibilities
Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, and multi-chip module; Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications; Work with Product Groups and Reliability teams to qualify new packages and processes; Ensure smooth transition into production by resolving process integration issues and establishing production controls; Develop and maintain technical expertise on advances in advanced leadframe, power SiP/modules, and flip chip interconnects; Address internal and external customer complaints with cross-functional teams.
Seniority
Senior, hands-on IC
