Staff Package Design Engineer
Core
Design and deliver next-generation, high-performance semiconductor package solutions including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, and wire-bonded packages for automotive SoCs, industrial IoT, and AI-enabled embedded platforms.
Role type
Staff IC package design engineer
Builds
Advanced semiconductor packages (power modules, FCBGA, SiP, WLCSP, multi-die/chiplet) for automotive, industrial, and IoT applications
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Package CAD layout execution, substrate design, bump map creation, escape routing, stack-up structure design, DFM/DFA principles, manufacturing release standards, cross-domain co-design, design rule compliance (DRC/LVS), Engineering Change Order management
Preferred skills
Power module packaging expertise, chiplet-based architecture experience, Tier-1 OSAT interfacing, high-speed routing and impedance control
Technologies
Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator
Responsibilities
Execute package layout design for advanced technologies; develop and maintain package CAD databases; manage the full package design cycle from schematic to manufacturing release; create and modify substrate/RDL layouts and bump maps; collaborate with SI/PI, thermal, and silicon teams on co-optimization; ensure compliance with foundry and OSAT design rules
Seniority
Staff, hands-on IC
