Thermal Analysis Engineer
Core
Drive scientific innovation in semiconductor assembly and packaging by designing, simulating, and developing novel devices, packages, and interconnects using device physics and thermomechanical analysis.
Role type
Senior IC semiconductor research engineer (packaging & interconnects)
Builds
Next-generation semiconductor assembly and packaging solutions (EMIB, Foveros architectures)
Domain
Semiconductor manufacturing, advanced packaging, thermomechanics
Required skills
Semiconductor fabrication processes, finite element analysis (FEA), computational fluid dynamics (CFD), Python/MATLAB programming, experimental setup design, Design of Experiments (DOE), statistical analysis, materials characterization, cross-disciplinary collaboration
Preferred skills
Advanced packaging technologies (EMIB, Foveros), model-based problem-solving, technical team leadership, mentoring
Technologies
Ansys, Abaqus, lithography, etch, diffusion, CVD, PVD, CMP
Responsibilities
Conduct research leveraging device physics and thermomechanical analysis to enable novel devices; Design and fabricate prototypes for proof-of-concept packaging technologies; Perform electrical testing and establish methodologies for device characterization; Develop process solutions across production modules; Plan and execute experiments to benchmark results against industry standards; Engage with external vendors and researchers to support the research pipeline
Seniority
Senior, hands-on IC