Process Engineer Senior
Core
Leads intermediate to complex projects in wafer prep and finishing areas of advanced packaging, focusing on process development, equipment ownership, and yield improvement.
Role type
Senior IC process engineer (semiconductor advanced packaging)
Builds
300mm wafer packaging toolsets and robust wafer packaging processes
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Wafer prep and finishing process expertise, Equipment ownership and maintenance, Statistical process control, Data analysis, Process development, IP development, Cross-functional collaboration
Preferred skills
MS in Chemical/Materials/Physics Engineering, Statistical software (JMP/Minitab), Active matrix TFT processing, Amorphous-silicon processes, Semiconductor advanced packaging experience, Thin film processing, Equipment maintenance
Technologies
JMP, Minitab, Dicing saws, Wafer grinders, Die attach equipment, Molding equipment, Ball drop/reflow equipment
Responsibilities
Maintain wafer prep and finishing operations, Respond to production issues and implement solutions, Write safety procedures for equipment users, Recommend and assist in equipment procurement, Provide supervision and guidance to students and faculty, Develop new processes and intellectual property
Seniority
Senior, hands-on IC
